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DA9179.002 19 May, 2005
MAS9179
AM Receiver IC
* Tri Band Receiver IC * High Sensitivity * Very Low Power Consumption * Wide Supply Voltage Range * Power Down Control * Control for AGC On * High Selectivity by Crystal Filter * Fast Startup Feature
DESCRIPTION
The MAS9179 AM-Receiver chip is a highly sensitive, simple to use AM receiver specially intended to receive time signals in the frequency range from 40 kHz to 100 kHz. Only a few external components are required for time signal receiving. The circuit has preamplifier, wide range automatic gain control, demodulator and output comparator built in. The output signal can be processed directly by an additional digital circuitry to extract the data from the received signal. The control for AGC (automatic gain control) can be used to switch AGC on or off if necessary. MAS9179 supports tri band operation by switching between three crystal filters and two additional antenna tuning capacitors. MAS9179 has differential input and different internal compensation capacitor options for compensating shunt capacitances of different crystals (See ordering information on page 9).
FEATURES
* * * * * * * * * * Tri Band Receiver IC Highly Sensitive AM Receiver, 0.4 VRMS typ. Wide Supply Voltage Range from 1.1 V to 5 V Very Low Power Consumption Power Down Control Fast Startup Only a Few External Components Necessary Control for AGC On Wide Frequency Range from 40 kHz to 100 kHz High Selectivity by Quartz Crystal Filter
APPLICATIONS
* Multi Band Time Signal Receiver WWVB (USA), JJY (Japan), DCF77 (Germany), MSF (UK), HGB (Switzerland) and BPC (China)
BLOCK DIAGRAM
QO3 RFIP RFIM QO2 QO1 QI AON Demodulator & Comparator OUT
AGC Amplifier
RFI2 RFI3
Power Supply/Biasing VDD VSS PDN1 PDN2 AGC DEC
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DA9179.002 19 May, 2005
PAD LAYOUT
MAS9179Ax, x=1..4
VDD QO2 QO1 QO3 QI AGC PDN2 OUT VSS RFI2 RFIM RFIP RFI3 PDN1 AON DEC
1620 m
DIE size = 1.62 x 1.89 mm; round PAD 80 m Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Coordinates are pad center points where origin has been located in bottom-left corner of the silicon die. Pad Identification Power Supply Voltage Quartz Filter Output for Crystal 2 Quartz Filter Output for Crystal 1 Quartz Filter Output for Crystal 3 Quartz Filter Input for Crystals AGC Capacitor Power Down/Frequency Selection Input 2 Receiver Output Demodulator Capacitor AGC On Control Power Down/Frequency Selection Input 1 Receiver Input 3 (for Antenna Capacitor 3) Positive Receiver Input Negative Receiver Input Receiver Input 2 (for Antenna Capacitor 2) Power Supply Ground Name VDD QO2 QO1 QO3 QI AGC PDN2 OUT DEC AON PDN1 RFI3 RFIP RFIM RFI2 VSS X-coordinate 174 m 174 m 174 m 174 m 174 m 174 m 174 m 175 m 1442 m 1442 m 1442 m 1442 m 1442 m 1442 m 1442 m 1442 m Y-coordinate 1657 m 1452 m 1248 m 1043 m 839 m 634 m 429 m 225 m 240 m 444 m 649 m 853 m 1058 m 1262 m 1467 m 1671 m Note
1892 m
3 1 2 3 4 4
Notes: 1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 A - at power down the output is pulled to VSS (pull down switch) 2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 A which is switched off at power down 3) PDN1 = VDD and PDN2 = VDD means receiver off - Fast start-up is triggered when the receiver is after power down controlled to power up 4) Receiver inputs RFIP and RFIM have both 600 k biasing MOSFET-transistors towards ground
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DA9179.002 19 May, 2005
FREQUENCY SELECTION
The frequency selection and power down control is accomplished via two digital control pins PDN1 and PDN2. The control logic is presented in table 1. Table 1 Frequency selection and power down control PDN2 RFI2 Switch RFI3 Switch PDN1 High High Low Low High Low High Low Open Open Closed Closed Open Open Open Closed Selected Crystal Output QO1 QO2 QO3 Description Power down Frequency 1 Frequency 2, RFI2 capacitor connected in parallel with antenna Frequency 3, RFI2 and RFI3 capacitors connected in parallel with antenna
The internal antenna tuning capacitor switches (RFI2, RFI3) and crystal filter output switches (QO1, QO2, QO3) are controlled according table 1. See switches in block diagram on page 1. If frequency 1 is selected the RFI2 and RFI3 switches are open and only crystal output QO1 is active. Antenna frequency is determined by antenna inductor LANT (see Typical Application on page 5), antenna capacitor CANT1 and parasitic capacitances related to antenna inputs RFIP, RFIM, RFI2 and RFI3 (see Antenna Tuning Considerations below). Frequency 1 is the highest frequency of the three selected frequencies. If frequency 2 is selected then RFI2 switch is closed to connect CANT2 to pin RFIM in parallel with ferrite antenna and tune it to frequency 2. Then only
crystal output QO2 is active. Frequency 2 is the medium frequency of the three selected frequencies. If frequency 3 is selected both RFI2 and RFI3 switches are closed to connect both CANT2 and CANT3 capacitors to RFIM pin in parallel with ferrite antenna and tune it to frequency 3. Then only crystal QO3 is active. Frequency 3 is the lowest frequency of the three selected frequencies. It is recommended to switch the device to power down for 50ms before switching to another frequency. This guarantees fast startup in switching to another frequency. The 50ms power down period is used to discharge AGC capacitor and to initialize fast startup conditions.
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DA9179.002 19 May, 2005
ANTENNA TUNING CONSIDERATIONS
The ferrite bar antenna having inductance LANT and parasitic coil capacitance CCOIL is tuned to three reception frequencies f1, f2 and f3 by parallel capacitors CANT1, CANT2 and CANT3. The receiver input stage and internal antenna capacitor switches have capacitances CRFIP, COFF2, COFF3 which affect the resonance frequencies. COFF2 and COFF3 are switch capacitances when switches are open. When switches are closed these capacitances are shorted by on resistance of the switches and they are effectively eliminated. Following relationships can be written into three tuning frequencies.
Frequency f1 (highest frequency): CTOT1=CCOIL+CANT1+CRFIP+COFF2+COFF3=CCOIL+CANT1+6pF+37pF+119pF=CCOIL+CANT1+162pF, 1 f1 = 2 L ANT CTOT 1 Frequency f2 (middle frequency): CTOT2=CCOIL+CANT1+CANT2+CRFIP+COFF3=CCOIL+CANT1+CANT2+ 6pF+119pF=CCOIL+CANT1+CANT2+ 125pF, 1 f2 = 2 L ANT CTOT 2 Frequency f3 (lowest frequency): CTOT3=CCOIL+CANT1+ CANT2+ CANT3+CRFIP=CCOIL+CANT1+ CANT2+ CANT3+6pF, 1 f3 = 2 L ANT CTOT 3
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DA9179.002 19 May, 2005
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Input Voltage Power Dissipation Operating Temperature Storage Temperature Symbol VDD-VSS VIN PMAX TOP TST Conditions Min -0.3 VSS-0.3 -40 -55 Max 6 VDD+0.3 100 +85 +150 Unit V V mW o C o C
ELECTRICAL CHARACTERISTICS
Operating Conditions: VDD = 1.4V, Temperature = 25C
Parameter Operating Voltage Current Consumption
Symbol VDD IDD
Conditions VDD=1.4 V, Vin=0 Vrms VDD=1.4 V, Vin=20 mVrms VDD=3.6 V, Vin=0 Vrms VDD=3.6 V, Vin=20 mVrms
Min 1.10
Typ 64 37 67 40
Max 5
Unit V A
31 27 40
Stand-By Current Input Frequency Range Minimum Input Voltage Maximum Input Voltage Receiver Input Resistance Receiver Input Capacitance RFI2 Switch On Resistance RFI2 Switch Off Capacitance RFI3 Switch On Resistance RFI3 Switch Off Capacitance Input Levels |lIN|<0.5 A Output Current VOL<0.2 VDD;VOH >0.8 VDD Output Pulse
IDDoff fIN VIN min VIN max RRFI CRFI RON2 COFF2 RON3 COFF3 VIL VIH |IOUT| T100ms T200ms T500ms T800ms
0.4 20 f=40kHz..77.5 kHz VDD=1.4 V VDD=1.4 V 0.8 VDD 5 1 Vrms VIN 20 mVrms 1 Vrms VIN 20 mVrms 1 Vrms VIN 20 mVrms 1 Vrms VIN 20 mVrms Fast Start-up, Vin=0.4 Vrms Fast Start-up, Vin=20 mVrms 50 150 400 700 500 800 1.3 3.5 50 230 6 3.8 37 2.4 119
91 65 0.1 100 1
A kHz Vrms mVrms k pF pF pF V A
0.2 VDD 140 230 600 900
ms ms ms ms s
Startup Time Output Delay Time
TStart TDelay
100
ms
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DA9179.002 19 May, 2005
TYPICAL APPLICATION
X3 X2 X1 Note 1 Optional Control for AGC on/hold QI AON Demodulator & Comparator OUT Receiver Output
QO3 LANT CANT1 CANT3 CANT2 RFIP
QO2
QO1
AGC Amplifier RFIM
Ferrite Antenna
RFI2 RFI3
Power Supply/Biasing VDD VBATTERY VSS PDN1 PDN2 AGC DEC + CAGC CDEC
Power Down / Fast Startup / Frequency Selection
Note 2
Figure 1
Application circuit of tri band receiver MAS9179
X3 40.003 kHz X2 60.003kHz X1 77.503kHz Optional Control for AGC on/hold QI AON Demodulator & Comparator OUT Receiver Output
QO3 LANT 3.07mH CANT1 1.2nF CANT3 0.91nF CANT2 3nF RFIP
QO2
QO1
AGC Amplifier RFIM
Ferrite Antenna
RFI2 RFI3
Power Supply/Biasing VDD 1.4 V VSS PDN1 PDN2 AGC DEC + CAGC 10 F Power Down / Fast Startup / Frequency Selection CDEC 47 nF
Figure 2
Example circuit of tri band receiver MAS9179 for DCF77/MSF/WWVB/JJY frequencies
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DA9179.002 19 May, 2005
TYPICAL APPLICATION (Continued)
Note 1: Crystals The crystals as well as ferrite antenna frequencies are chosen according to the time-signal system (Table 2). The crystal shunt capacitance C0 should be matched as well as possible with the internal shunt capacitance compensation capacitor CC of MAS9179. See Compensation Capacitance Options on table 3. Table 2 Time-Signal System Frequencies Time-Signal System Location DCF77 HGB MSF WWVB JJY BPC Germany Switzerland United Kingdom USA Japan China Antenna Frequency 77.5 kHz 75 kHz 60 kHz 60 kHz 40 kHz and 60 kHz 68.5 kHz Recommended Crystal Frequency 77.503 kHz 75.003 kHz 60.003 kHz 60.003 kHz 40.003 kHz and 60.003 kHz 68.505 kHz
Table 3 Compensation Capacitance Options Crystal Description Device CC MAS9179A1 MAS9179A2 MAS9179A3 MAS9179A4 0.75 pF 0.875 pF 1.25 pF 1.5 pF For low C0 crystal For low C0 crystal For high C0 crystal For high C0 crystal
It should be noted that grounded crystal package has reduced shunt capacitance. This value is about 85% of floating crystal shunt capacitance. For example crystal with 1pF floating package shunt capacitance can have 0.85pF grounded package shunt capacitance. PCB traces of crystal and external compensation capacitance should be kept at minimum to minimize additional parasitic capacitance which can cause capacitance mismatching. Highest frequency crystal is connected to crystal output pin 1 (QO1). Medium frequency crystal is connected to crystal output pin 2 (QO2). Lowest frequency crystal is connected to crystal output pin 3 (QO3). The other pin of each crystal is connected to common crystal input pin QI. Table 4 below presents some crystal manufacturers having suitable crystals for timesignal receiver application. Table 4. Crystal Manufacturers and Crystal Types in Alphaphetical Order for Timesignal Receiver Application Manufacturer Crystal Type Dimensions Web Link Citizen Epson KDS Daishinku Microcrystal Seiko Instruments CFV-206 C-2-Type C-4-Type DT-261 MX1V-L2N MX1V-T1K VTC-120 o 2.0 x 6.0 o 1.5 x 5.0 o 2.0 x 6.0 o 2.0 x 6.0 o 2.0 x 6.0 o 2.0 x 8.1 o 1.2 x 4.7 http://www.citizen.co.jp/tokuhan/quartz/ http://www.epsondevice.com/e/ http://www.kdsj.co.jp/english.html http://www.microcrystal.com/ http://speed.sii.co.jp/pub/compo/quartz/topE.jsp
Note 2: AGC Capacitor The AGC and DEC capacitors must have low leakage currents due to very small signal currents through the capacitors. The insulation resistance of these capacitors should be at minimum 100 M. Also probes with at least 100 M impedance should be used for voltage probing of AGC and DEC pins. DEC capacitor can be low leakage chip capacitor.
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DA9179.002 19 May, 2005
MAS9179 SAMPLES IN SBDIL 20 PACKAGE
NC 1 VDD 2 QO2 3 QO1 4 QO3 5 NC 6 QI 7 AGC 8 PDN2 9 OUT 10
9179Az YYWW XXXXX.X
20 VSS 19 RFI2 18 RFIM 17 RFIP 16 RFI3 15 NC 14 PDN1 13 AON 12 DEC 11 NC
Top Marking Definitions: YYWW = Year Week XXXXX.X = Lot Number z = Sample Version Number
PIN DESCRIPTION
Pin Name NC VDD QO2 QO1 QO3 NC QI AGC PDN2 OUT NC DEC AON PDN1 NC RFI3 RFIP RFIM RFI2 VSS Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Type P AO AO AO AI AO DI DO AO DI DI AI AI AI AI G Function Positive Power Supply Quartz Filter Output for Crystal 2 Quartz Filter Output for Crystal 1 Quartz Filter Output for Crystal 3 1 Quartz Filter Input for Crystal AGC Capacitor Power Down/Frequency Selection Input 2 Receiver Output Demodulator Capacitor AGC On Control Power Down/Frequency Selection Input 1 Receiver Input 3 (for Antenna Capacitor 3) Positive Receiver Input Negative Receiver Input Receiver Input 2 (for Antenna Capacitor 2) Power Supply Ground Note
3 2
4 3
5 5
A = Analog, D = Digital, P = Power, G = Ground, I = Input, O = Output, NC = Not Connected
Notes: 1) Pin 6 between QO3 and QI must be connected to VSS to eliminate DIL package leadframe parasitic capacitances disturbing the crystal filter performance. All other NC (Not Connected) pins are also recommended to be connected to VSS to minimize noise coupling. 2) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced (modulated) - the output is a current source/sink with |IOUT| > 5 A - at power down the output is pulled to VSS (pull down switch) 3) PDN1 = VDD and PDN2 = VDD means receiver off - Fast start-up is triggered when the receiver is after power down controlled to power up 4) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working) - Internal pull-up with current < 1 A which is switched off at power down 5) Receiver inputs RFIP and RFIM have both 600 k biasing MOSFET-transistors towards ground
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DA9179.002 19 May, 2005
ORDERING INFORMATION
Product Code MAS9179A1TC00 MAS9179A2TC00 MAS9179A3TC00 MAS9179A4TC00 Product Tri Band AM-Receiver IC with Differential Input Tri Band AM-Receiver IC with Differential Input Tri Band AM-Receiver IC with Differential Input Tri Band AM-Receiver IC with Differential Input Description EWS-tested wafer, Thickness 400 m. EWS-tested wafer, Thickness 400 m. EWS-tested wafer, Thickness 400 m. EWS-tested wafer, Thickness 400 m. Capacitance Option CC = 0.75 pF CC = 0.875 pF CC = 1.25 pF CC = 1.5 pF
Contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com
NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
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